PREPERM® 3D filaments nominated as finalist in EDI CON Innovation Awards!

News from Premix | 18/03/14

Premix’s high frequency PREPERM® material was selected among the finalists in Innovation Awards held in conjunction with the EDI CON Conference on March 20-21 in Beijing, China. The winner will be announced at the exhibition on Tue March 20th.

The first EDI CON Innovation Awards were open to all exhibitors. A panel made up of Microwave Journal and Signal Integrity Journal editors and EDI CON advisory board members determined the 15 finalists and will select the winners.

Premix was selected as a finalist in Materials, PCBs and Packaging category with its unique 3D printing filament portfolio consisting of ABS filaments whose dielectric constant is tailored between 3 and 10. The relatively low dissipation factor 0.004 enables rapid prototyping of complex geometries.

 

 

3D printing is a one-step process which significantly simplifies the manufacturing process and reduces material waste. Furthermore, 3D printing can create perforated structures that are difficult to achieve by machining due to the mechanical strength of the material.

Stop by at our booth #628 in EDI CON Conference and come see for yourself!

Please read more about the Edicon Innovation Awards in the Microwave Journal and more about the EDI CON Conference at www.ediconchina.com! To find out more about 3D printing and PREPERM®  high frequency material, please visit our website www.preperm.com.

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